SIC Code 3674-01 - Semiconductor Devices (Manufacturing)
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SIC Code 3674-01 Description (6-Digit)
Semiconductor Devices (Manufacturing)" is a subdivision of the SIC Code 3674, which involves the production of electronic components made of semiconductor materials. These devices are used in a wide range of applications, including computers, telecommunications, consumer electronics, and automotive industries. The manufacturing process of semiconductor devices involves several stages, including design, fabrication, testing, and packaging. The industry is highly specialized and requires a high level of expertise in materials science, electrical engineering, and physics.
Hierarchy Navigation for SIC 6-Digit Code 3674-01
Parent Code (less specific)
Tools
- Photolithography equipment
- Ion implantation machines
- Chemical vapor deposition (CVD) equipment
- Plasma etching machines
- Wafer bonding machines
- Metrology equipment
- Ion beam milling machines
- Rapid thermal processing (RTP) equipment
- Wire bonding machines
- Die attach machines
- Flipchip bonders
- Probing stations
- Automated test equipment (ATE)
- Wafer saws
- Chemical mechanical polishing (CMP) machines
- Wafer cleaning equipment
- Sputtering machines
- Evaporation machines
- Laser trimming machines
Industry Examples of Semiconductor Devices (Manufacturing)
- Microprocessors
- Memory chips
- Power transistors
- Lightemitting diodes (LEDs)
- Solar cells
- Radio frequency (RF) devices
- Microelectromechanical systems (MEMS)
- Image sensors
- Display drivers
- Analogtodigital converters (ADCs)
- Digitaltoanalog converters (DACs)
- Voltage regulators
- Fieldeffect transistors (FETs)
- Diodes
- Thyristors
- Integrated circuits (ICs)
- Systemonchip (SoC)
- Microcontrollers
- Sensors
SIC Code 3674-01 - Semiconductor Devices (Manufacturing)
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